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Invitation to Discover JWEI’s Innovations at Labelexpo Americas 2024!
Update: 2024-08-26
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Dear Valued Customers,

We are excited to invite you to join us at Labelexpo Americas 2024, the premier event for the label and package printing industry in the Americas!

  • Dates: September 10-12, 2024
  • Venue: Donald E. Stephens Convention Center, Chicago, USA
  • Booth No.: 3136

At our booth, we will be showcasing our advanced RSF-330 and RSF-360 label cutting machines. These state-of-the-art machines are engineered to boost productivity, minimize waste, and deliver outstanding precision and efficiency. Highlights include:

  • Flexible roll-to-roll and roll-to-sheet capabilities
  • Quick setup with no dies required
  • Precise automatic segmentation
  • Reduced material waste
  • High slitting speed up to 60m/min

Our expert team will be on hand for live demonstrations and to answer any questions you may have.

We look forward to seeing you at Booth 3136!

Best regards,

JWEI Sales Team


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